IP Library › Assignment 047224/0062
Patent Assignment
Reel/Frame 047224/0062

Assignment of Assignor's Interest

Recorded: 2018-10-18 Pages: 4
Assignors
HU, YU-HSIANG
Executed: 2018-10-09
YU, CHEN-HUA
Executed: 2018-10-09
KUO, HUNG-JUI
Executed: 2018-10-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property (1)
Chip Package and Method of Forming the Same
Application: 16/164,752 →
Publication: US 2020/0126923
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →