IP Library Assignment 047248/0144
Patent Assignment
Reel/Frame 047248/0144

Release of Security Interest

Recorded: 2018-06-26 Pages: 4
Assignor
Assignee
NEHP INC.
11789 WEST EXECUTIVE DRIVE, BOISE, IDAHO, 83713
Covered Property (1)
Method for Installation of Semiconductor Fabrication Tools
Patent: 7,039,999 →
Application: 10/423,282 →
Publication: US 2003/0200638
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 4, 2007
From: CHABOT, GERALD
To: NEHP, INC.
Reel/Frame 019920/0157 →
Assignment of Assignor's Interest Nov 21, 2008
From: TARR, ADAM L.
To: NEHP INC.
Reel/Frame 021861/0656 →
Security Agreement Oct 11, 2012
From: NEHP INC.
To: RBS CITIZENS, N.A.
Reel/Frame 029116/0497 →
Security Interest Jun 25, 2018
From: NEHP INC.
To: LBC CREDIT AGENCY SERVICES, LLC, AS AGENT
Reel/Frame 046187/0463 →
Release of Security Interest Nov 9, 2021
From: LBC CREDIT AGENCY SERVICES, LLC, AS AGENT
To: NEHP INC.
Reel/Frame 058058/0986 →