Patent Assignment
Reel/Frame 047275/0662
Assignment of Assignor's Interest
Recorded: 2018-10-23
Pages: 4
Assignors
OHNO, HIROKI
Executed: 2018-10-01
INADA, TAKAO
Executed: 2018-10-03
KAWANO, HISASHI
Executed: 2018-10-02
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Substrate Processing Method and Recording Medium