Patent Assignment
Reel/Frame 047279/0641
Assignment of Assignor's Interest
Recorded: 2018-10-23
Pages: 4
Assignors
HUANG, YING-JUI
Executed: 2018-09-25
HWANG, CHIEN LING
Executed: 2018-09-25
LIN, CHIH-WEI
Executed: 2018-09-25
HSIEH, CHING-HUA
Executed: 2018-09-25
LIU, CHUNG-SHI
Executed: 2018-09-28
YU, CHEN-HUA
Executed: 2018-09-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Aligning Bumps in Fan-Out Packaging Process