Patent Assignment
Reel/Frame 047289/0113
Assignment of Assignor's Interest
Recorded: 2018-10-24
Pages: 5
Assignors
OH, SEONG HWAN
Executed: 2018-08-23
OH, KYUNG SUK
Executed: 2018-08-23
KIM, KILSOO
Executed: 2018-08-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Semiconductor Package Including the Same