Patent Assignment
Reel/Frame 047293/0446
Assignment of Assignor's Interest
Recorded: 2018-08-14
Pages: 4
Assignors
WANG, PO-HAN
Executed: 2018-06-25
KUO, HUNG-JUI
Executed: 2018-06-25
HU, YU-HSIANG
Executed: 2018-06-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Comprising Molding Compound Having Extended Portion and Manufacturing Method of Semiconductor Package