IP Library › Assignment 047309/0302
Patent Assignment
Reel/Frame 047309/0302

Assignment of Assignor's Interest

Recorded: 2018-10-25 Pages: 6
Assignors
KIRINO, HIDEKI
Executed: 2018-10-04
KAMO, HIROYUKI
Executed: 2018-10-04
Assignees
NIDEC CORPORATION
338 KUZETONOSHIRO-CHO, MINAMI-KU, KYOTO, 601-8205, JAPAN
WGR CO., LTD.
8E10 ADV. SCI., TECH. & MGMT., RES. INST. OF KYOTO, 134, CHUDOJI MINAMI-MACHI, SHIMOGYO-KU, KYOTO-CITY, KYOTO, 600-8813, JAPAN
Covered Property (1)
Mounting Substrate, Waveguide Module, Integrated Circuit-Mounted Substrate, Microwave Module
Application: 16/170,172 →
Publication: US 2019/0067780