Patent Assignment
Reel/Frame 047313/0377
Assignment of Assignor's Interest
Recorded: 2018-10-25
Pages: 7
Assignors
KIM, JIN-A
Executed: 2018-08-06
KIM, YONG-KWAN
Executed: 2018-08-06
PARK, SE-KEUN
Executed: 2018-08-06
LEE, JOO-YOUNG
Executed: 2018-08-06
KOH, CHA-WON
Executed: 2018-08-04
LEE, YEONG-CHEOL
Executed: 2018-08-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same