Patent Assignment
Reel/Frame 047316/0388
Assignment of Assignor's Interest
Recorded: 2018-10-25
Pages: 14
Assignors
LIU, LIU
Executed: 2018-08-29
DAYCOCK, DAVID
Executed: 2018-10-02
BHONSLE, RITHU K.
Executed: 2018-09-10
MAZZONE, GIOVANNI
Executed: 2018-09-10
BILIK, NARULA
Executed: 2018-10-15
GREENLEE, JORDAN D.
Executed: 2018-10-24
LEE, MINSOO
Executed: 2018-10-22
LI, BENBEN
Executed: 2018-10-23
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1-525, BOISE, IDAHO, 83716
Covered Property
(1)
Integrated Assemblies Which Include Stacked Memory Decks, and Methods of Forming Integrated Assemblies
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest
Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →