Patent Assignment
Reel/Frame 047322/0418
Assignment of Assignor's Interest
Recorded: 2018-10-26
Pages: 6
Assignors
HUNG, TUAN-YU
Executed: 2018-09-19
KUO, HUNG-JUI
Executed: 2018-09-19
PAN, HSIN-YU
Executed: 2018-09-19
HO, MING-CHE
Executed: 2018-09-19
HUANG, TZU YUN
Executed: 2018-09-19
SU, YEN-FU
Executed: 2018-09-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same