Patent Assignment
Reel/Frame 047322/0438
Assignment of Assignor's Interest
Recorded: 2018-10-26
Pages: 6
Assignors
HSIEH, WEI KANG
Executed: 2018-09-28
KUO, HUNG-YI
Executed: 2018-09-27
TSAI, HAO-YI
Executed: 2018-09-28
PAN, KUO LUNG
Executed: 2018-09-27
KUO, TIN-HAO
Executed: 2018-09-27
LAI, YU-CHIA
Executed: 2018-09-27
CHANG, MAO-YEN
Executed: 2018-09-20
TENG, PO-YUAN
Executed: 2018-09-27
CHUN, SHU-RONG
Executed: 2018-09-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semicondcutor Package and Manufacturing Method of Semicondcutor Package