IP Library Assignment 047323/0396
Patent Assignment
Reel/Frame 047323/0396

Assignment of Assignor's Interest

Recorded: 2018-10-26 Pages: 3
Assignors
YANG, YI
Executed: 2018-08-30
SHEN, DONGNA
Executed: 2018-08-30
WANG, YU-JEN
Executed: 2018-08-30
Assignee
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Highly Physical Etch Resistive Photoresist Mask to Define Large Height Sub 30nm Via and Metal Hard Mask for MRAM Devices
Application: 16/133,955 →
Publication: US 2020/0091419
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 25, 2019
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048692/0917 →