Patent Assignment
Reel/Frame 047339/0271
Assignment of Assignor's Interest
Recorded: 2018-10-29
Pages: 3
Assignors
TSAI, KUO-CHIANG
Executed: 2018-10-18
SU, FU-HSIANG
Executed: 2018-10-19
CHEN, YI-JU
Executed: 2018-10-18
CHEN, JYH-HUEI
Executed: 2018-10-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Contact Structure with Insulating Cap