Patent Assignment
Reel/Frame 047373/0199
Assignment of Assignor's Interest
Recorded: 2018-10-31
Pages: 3
Assignors
TSAI, KUO-CHIANG
Executed: 2018-10-09
CHEN, JYH-HUEI
Executed: 2018-10-09
CHENG, JYE-YEN
Executed: 2018-10-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Devices Having Raised via Contacts and Methods of Fabricating the Same