Patent Assignment
Reel/Frame 047375/0531
Assignment of Assignor's Interest
Recorded: 2018-10-31
Pages: 8
Assignors
FENG, LI-WEI
Executed: 2018-10-17
HUNG, YU-HSIANG
Executed: 2018-10-17
WEI, MING-TE
Executed: 2018-10-17
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof