Patent Assignment
Reel/Frame 047381/0608
Assignment of Assignor's Interest
Recorded: 2018-11-01
Pages: 4
Assignors
TSAI, TSUNG-FU
Executed: 2018-10-22
TSAI, CHEN-HSUAN
Executed: 2018-10-22
TING, CHUNG-CHIEH
Executed: 2018-10-23
LIN, SHIH-TING
Executed: 2018-10-22
LU, SZU-WEI
Executed: 2018-10-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with Dummy Micro Bumps Between Stacking Dies to Improve Flowability of Underfill Material