Patent Assignment
Reel/Frame 047382/0643
Assignment of Assignor's Interest
Recorded: 2018-11-01
Pages: 4
Assignors
TSAI, CHUNG-HAO
Executed: 2018-10-05
LIN, CHIA-CHIA
Executed: 2018-10-05
WU, KAI-CHIANG
Executed: 2018-10-05
WANG, CHUEI-TANG
Executed: 2018-10-05
YU, CHEN-HUA
Executed: 2018-10-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming Semiconductor Packages Having a Die with an Encapsulant