Patent Assignment
Reel/Frame 047382/0647
Assignment of Assignor's Interest
Recorded: 2018-11-01
Pages: 5
Assignors
CHEN, YU-WEI
Executed: 2018-09-14
KUO, LI-CHUNG
Executed: 2018-09-19
SHIH, YING-CHING
Executed: 2018-09-19
LU, SZU-WEI
Executed: 2018-09-19
LIN, JING-CHENG
Executed: 2018-10-10
LEE, LONG HUA
Executed: 2018-09-21
HUANG, KUAN-YU
Executed: 2018-09-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Underfill Structure for Semiconductor Packages and Methods of Forming the Same