Patent Assignment
Reel/Frame 047385/0871
Assignment of Assignor's Interest
Recorded: 2018-11-01
Pages: 6
Assignors
HAN, WON-GIL
Executed: 2018-08-30
LEE, SEUNG-LO
Executed: 2018-08-30
LEE, YONG-JE
Executed: 2018-08-30
CHO, SUNG-IL
Executed: 2018-08-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Multiple Semiconductor Chips and Method of Manufacturing the Semiconductor Package