Patent Assignment
Reel/Frame 047394/0498
Assignment of Assignor's Interest
Recorded: 2018-11-02
Pages: 3
Assignors
WU, MING-HUNG
Executed: 2018-10-05
WU, CHI-FU
Executed: 2018-10-04
TSENG, AN-PING
Executed: 2018-10-04
WU, HAO-YU
Executed: 2018-10-05
Assignee
TDK TAIWAN CORP.
NO. 159, SEC. 1, ZHONGSHAN N. RD. YANGMEI DIST., TAOYUAN CITY, 326, TAIWAN
Covered Property
(1)
Thermal-Dissipating Substrate Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.