IP Library › Assignment 072250/0984
Patent Assignment
Reel/Frame 072250/0984

Assignment of Assignor's Interest

Recorded: 2025-09-15 Pages: 5
Assignor
TDK TAIWAN CORP.
Executed: 2025-09-09
Assignee
TDK CORPORATION
2-5-1 NIHONBASHI, CHUO-KU, TOKYO, 103-6128, JAPAN
Covered Properties (3)
Thermal-Dissipating Substrate Structure
Application: 16/176,971 →
Publication: US 2019/0139854
Package Structure Having a Plurality of Insulating Layers
Application: 16/183,128 →
Publication: US 2019/0139860
Sensor
Application: 16/430,993 →
Publication: US 2020/0185327
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 2, 2018
From: WU, MING-HUNG; WU, CHI-FU; TSENG, AN-PING; WU, HAO-YU
To: TDK TAIWAN CORP.
Reel/Frame 047394/0498 →
Assignment of Assignor's Interest Nov 8, 2018
From: WU, MING-HUNG; WU, CHI-FU; TSENG, AN-PING; WU, HAO-YU
To: TDK TAIWAN CORP.
Reel/Frame 047453/0943 →
Assignment of Assignor's Interest Jun 11, 2019
From: TSENG, AN-PING; WU, CHI-FU; WU, HAO-YU; WU, MING-HUNG
To: TDK TAIWAN CORP.
Reel/Frame 049433/0690 →