Patent Assignment
Reel/Frame 047396/0322
Assignment of Assignor's Interest
Recorded: 2018-11-02
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Package-On-Package (Pop) Semiconductor Package and Electronic System Including the Same