Patent Assignment
Reel/Frame 047399/0576
Assignment of Assignor's Interest
Recorded: 2018-11-02
Pages: 3
Assignors
KAWASAKI, TAKAHIKO
Executed: 2018-10-15
MATSUI, YUKITERU
Executed: 2018-10-23
GAWASE, AKIFUMI
Executed: 2018-10-15
Assignee
TOSHIBA MEMORY CORPORATION
1-1 SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-0023, JAPAN
Covered Property
(1)
Polishing Pad, Semiconductor Fabricating Device and Fabricating Method of Semiconductor Device
Application:
16/109,665 →
Publication:
US 2019/0283206