Assignment of Assignor's Interest

Recorded: 2018-11-06 Pages: 3

Assignors

YANG, YI

Executed: 2018-05-30

SHEN, DONGNA

Executed: 2018-05-31

WANG, YU-JEN

Executed: 2018-05-31

Assignee

HEADWAY TECHNOLOGIES, INC.

678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035

Covered Property (1)

Sub 60nm Etchless MRAM Devices by Ion Beam Etching Fabricated T-Shaped Bottom Electrode

Patent: 10,418,547 →

Application: 16/008,629 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.