Patent Assignment
Reel/Frame 047420/0017
Assignment of Assignor's Interest
Recorded: 2018-11-06
Pages: 4
Assignor
GUO, SHUAI
Executed: 2018-08-27
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, 430074, CHINA
Covered Property
(1)
Methods and Systems for Adjusting Wafer Deformation During Wafer Bonding