Patent Assignment
Reel/Frame 047420/0826
Assignment of Assignor's Interest
Recorded: 2018-11-06
Pages: 5
Assignors
LEE, HUNTEAK
Executed: 2018-11-06
YANG, DEOKKYUNG
Executed: 2018-11-06
LEE, HEESOO
Executed: 2018-11-06
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.