Patent Assignment
Reel/Frame 047423/0612
Assignment of Assignor's Interest
Recorded: 2018-11-06
Pages: 5
Assignors
YANG, CHENG-YU
Executed: 2017-08-29
YU, CHIA-TA
Executed: 2017-08-29
LEE, KAI-HSUAN
Executed: 2017-08-29
YEONG, SAI-HOOI
Executed: 2017-08-29
YANG, FENG-CHENG
Executed: 2017-08-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
FinFET Device with Wrapped-Around Epitaxial Structure and Manufacturing Method Thereof