Patent Assignment
Reel/Frame 047424/0850
Assignment of Assignor's Interest
Recorded: 2018-11-06
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Shrinking Openings in Forming Integrated Circuits