Patent Assignment
Reel/Frame 047425/0704
Assignment of Assignor's Interest
Recorded: 2018-11-06
Pages: 7
Assignors
BAI, KEUN HEE
Executed: 2018-09-11
KANG, SUNG WOO
Executed: 2018-09-17
KWON, KEE SANG
Executed: 2018-09-17
LEE, DONG SEOK
Executed: 2018-09-11
LEE, SANG HYUN
Executed: 2018-09-17
LEE, JEONG YUN
Executed: 2018-09-17
JEON, YONG-HO
Executed: 2018-09-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Self-Aligned Contact and Method of Fabricating the Semiconductor Device