IP Library Assignment 047426/0088
Patent Assignment
Reel/Frame 047426/0088

Assignment of Assignor's Interest

Recorded: 2018-11-06 Pages: 11
Assignors
BANCOD, LUDOVICO E.
Executed: 2018-07-24
LANZONE, ROBERT
Executed: 2018-07-30
KIM, GI JUNG
Executed: 2018-07-23
KIM, JIN SEONG
Executed: 2018-07-30
ADLAM, EDWIN J.
Executed: 2018-07-23
LEE, JAE UNG
Executed: 2018-07-24
LEE, YUNG WOO
Executed: 2018-07-13
CHOI, MI KYEONG
Executed: 2018-08-09
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package and Manufacturing Method Thereof
Application: 16/037,686 →
Publication: US 2018/0323170
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →