IP Library Assignment 047434/0282
Patent Assignment
Reel/Frame 047434/0282

Assignment of Assignor's Interest

Recorded: 2018-11-07 Pages: 6
Assignors
LU, ZHENYU
Executed: 2018-09-12
YANG, SIMON SHI-NING
Executed: 2018-09-12
CHEN, JUN
Executed: 2018-09-12
WU, GUANPING
Executed: 2018-09-12
SHI, WENGUANG
Executed: 2018-10-15
CHENG, WEIHUA
Executed: 2018-09-12
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, 430074, CHINA
Covered Property (1)
Hybrid Bonding Contact Structure of Three-Dimensional Memory Device
Application: 16/046,852 →
Publication: US 2019/0057974
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Consulting Agreement in Lieu of Assignment Nov 27, 2024
From: PAN, FENG; YANG, STEVE WEIYI
To: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Reel/Frame 069458/0801 →