Patent Assignment
Reel/Frame 047452/0775
Assignment of Assignor's Interest
Recorded: 2018-11-08
Pages: 3
Assignor
TAGUCHI, YASUHIRO
Executed: 2018-09-25
Assignee
ABLIC INC.
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Resin Encapsulating Mold and Method of Manufacturing Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.