Resin encapsulating mold and method of manufacturing semiconductor device
A die pad is set down at a height lower than a height at which inner leads are provided and a level difference for the set-down becomes larger than a depth of a lower-mold cavity formed in a lower mold. The die pad is placed so that a back surface of the die pad is brought into contact with a lower-mold cavity bottom surface. The lead frame is clamped between the lower mold and an upper mold which has an upper-mold cavity and a suspension-lead relief groove formed to communicate with an end of an opening of the upper-mold cavity to achieve resin encapsulation.
1. A resin encapsulating mold for a semiconductor device in which a surface of a die pad opposite to a semiconductor-chip mounted surface of the die pad is exposed from a resin encapsulating body, the resin encapsulating mold comprising:
a lower mold having a lower-mold cavity, the lower-mold cavity configured to receive the die pad such that the surface of the die pad opposite to the semiconductor-chip mounted surface of the die pad is exposed to a lower surface of the lower-mold cavity; and
an upper mold having a first upper-mold cavity and a second upper-mold cavity, the first upper-mold cavity opposing the lower-mold cavity and having an opening, and the second upper-mold cavity communicating with an end of the opening of the first upper-mold cavity.
2. The resin encapsulating mold according to claim 1 , wherein a depth of the second upper-mold cavity is smaller than a depth of the first upper-mold cavity.
3. The resin encapsulating mold according to claim 2 , wherein the depth of the second upper-mold cavity is equal to or larger than a difference between a bending depth of the die pad that is set down and a depth of the lower-mold cavity.
4. The resin encapsulating mold according to claim 1 , wherein the second upper-mold cavity opposes a top surface of the lower mold surrounding and defining, in part, the lower-mold cavity.
5. The resin encapsulating mold according to claim 1 , wherein the upper mold further comprises a bottom surface surrounding and defining, in part, the second upper-mold cavity, the bottom surface of the upper mold opposing a top surface of the lower mold.
6. The resin encapsulating mold according to claim 5 , wherein the bottom surface of the upper mold and the top surface of the lower mold opposite to the bottom surface of the upper mold are configured to clamp suspension leads therebetween, the suspension leads being connected to the die pad.
7. The resin encapsulating mold according to claim 6 , wherein the second upper-mold cavity is configured to accommodate portions of the suspension leads that deform upward to project into the second upper-mold cavity when the suspension leads are clamped between the top surface of the lower mold and the bottom surface of the upper mold.