Patent Assignment
Reel/Frame 047464/0618
Assignment of Assignor's Interest
Recorded: 2018-11-09
Pages: 6
Assignors
BAEK, SEUNG CHANG
Executed: 2018-11-09
SON, HYEONG SAM
Executed: 2018-11-09
SONG, CHANG JIN
Executed: 2018-11-09
SHIN, CHANG HYEOK
Executed: 2018-11-09
CHO, SUNG HO
Executed: 2018-11-09
CHO, CHONG KUN
Executed: 2018-11-09
HWANG, HAN GYU
Executed: 2018-11-09
YOO, MIN WOO
Executed: 2018-11-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Thin Housing, and Manufacturing Method Therefor