Patent Assignment
Reel/Frame 047465/0784
Assignment of Assignor's Interest
Recorded: 2018-11-09
Pages: 3
Assignors
KAO, CHIH-KUANG
Executed: 2018-10-12
PENG, TA-CHIH
Executed: 2018-10-12
KAO, MING-HONG
Executed: 2018-10-12
YANG, HUEI-WEN
Executed: 2018-10-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Forming the Same