Patent Assignment
Reel/Frame 047469/0850
Assignment of Assignor's Interest
Recorded: 2018-09-11
Pages: 4
Assignors
LAI, YU-CHIA
Executed: 2018-08-29
PAN, KUO LUNG
Executed: 2018-08-30
KUO, HUNG-YI
Executed: 2018-08-29
KUO, TIN-HAO
Executed: 2018-08-29
TSAI, HAO-YI
Executed: 2018-08-29
LIU, CHUNG-SHI
Executed: 2018-08-30
YU, CHEN-HUA
Executed: 2018-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
AT 8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Chip Semiconductor Package