Patent Assignment
Reel/Frame 047517/0797
Assignment of Assignor's Interest
Recorded: 2018-11-15
Pages: 5
Assignors
KAMGAING, TELESPHOR
Executed: 2018-11-09
DOGIAMIS, GEORGIOS
Executed: 2018-11-09
ALEKSOV, ALEKSANDAR
Executed: 2018-11-09
DEWEY, GILBERT W.
Executed: 2018-11-09
LEE, HYUNG-JIN
Executed: 2018-11-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Semiconductor Package Comprising Chiplets Disposed on a Substrate Which Are Electromagnetically Coupled by Dielectric Waveguides and a Computing Networks Formed Therefrom