Patent Assignment
Reel/Frame 047519/0124
Assignment of Assignor's Interest
Recorded: 2018-11-15
Pages: 5
Assignors
HUSKA, ANDREW
Executed: 2015-11-12
PETERSON, CODY
Executed: 2015-11-12
ADAMS, CLINT
Executed: 2015-11-12
KUPCOW, SEAN
Executed: 2015-11-12
Assignee
ROHINNI, LLC
2139 N MAIN STREET, COEUR D'ALENE, IDAHO, 83814
Covered Property
(1)
Method and Apparatus for Direct Transfer of Semiconductor Device Die from a Mapped Wafer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.