Patent Assignment
Reel/Frame 047528/0751
Assignment of Assignor's Interest
Recorded: 2018-11-16
Pages: 7
Assignors
YANG, DEOKKYUNG
Executed: 2018-11-15
LEE, HUNTEAK
Executed: 2018-11-15
LEE, HEESOO
Executed: 2018-11-15
LEE, WANIL
Executed: 2018-11-15
LEE, SANGDUK
Executed: 2018-11-14
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.