IP Library › Assignment 047538/0611
Patent Assignment
Reel/Frame 047538/0611

Assignment of Assignor's Interest

Recorded: 2018-11-19 Pages: 4
Assignors
TRUHITTE, DARRELL D.
Executed: 2016-11-07
LETTERMAN, JAMES P., JR.
Executed: 2016-11-21
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Methods of Forming Leadless Semiconductor Packages with Plated Leadframes and Wettable Flanks
Application: 16/194,734 →
Publication: US 2019/0088579
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 13, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 048327/0670 →
Release of Security Interest in Patents Recorded at Reel 048327, Frame 0670 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064079/0001 →