Patent Assignment
Reel/Frame 048327/0670
Security Interest
Recorded: 2019-02-13
Pages: 15
Assignors
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Executed: 2019-01-22
FAIRCHILD SEMICONDUCTOR CORPORATION
Executed: 2019-01-22
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET, NEW YORK, NEW YORK, 10005
Covered Properties
(101)
Methods and Apparatus for a Power Supply Control Circuit
Electronic Device Including a Transistor with a Non-uniform 2DEG
Semiconductor Device and Method of Forming a Curved Image Sensor
Semiconductor Device and Method of Forming a Curved Image Sensor
Application:
16/148,563 →
Publication:
US 2019/0035718
Semiconductor Device and Method of Forming Wlcsp
Diode with Current Sensor
Thermal Gradient Correction of a Current Monitor Signal
Methods and Apparatus for an Amplifier Circuit
Multiple Linear Regulation
Methods and Apparatus for Measuring Battery Characteristics
Image Sensor with Multiple Pixel Access Settings
Image Breathing Correction Systems and Related Methods
Application:
16/156,516 →
Publication:
US 2019/0050671
Embedded Image Sensor Semiconductor Packages and Related Methods
Embedded Image Sensor Semiconductor Packages and Related Methods
Circuit and Method for Coil Current Control
Audio Amplifier Having Multiple Sigma-Delta Modulators to Drive an Output Load
Time Delay Integration Image Sensors with Non-Destructive Readout Capabilities
Backside Illuminated Global Shutter Pixel with Active Reset
Indicator Using Existing Power Supply Controller Terminals
Wireless Communication System and Method Powered by an Energy Harvester
Application:
16/169,029 →
Publication:
US 2020/0136425
Variable Resistance to Reduce Gate Votlage Oscillations in Gallium Nitride Transistors
Methods and Systems of Limiting Exposure to Infrared Light
Switch Circuit with High Voltage Protection That Reduces Leakage Currents
Imaging Pixels with Depth Sensing Capabilities
Application:
16/174,558 →
Publication:
US 2019/0089944
Level Shifter with Deterministic Output During Power-Up Sequence
Semiconductor Package Structure and Related Methods
Switched Mode Power Supply with Dynamic Frequency Foldback
Multi-Axis Gyroscope with Reduced Bias Drift
Application:
16/179,599 →
Publication:
US 2020/0141732
Electronic Device Including a Drift Region
Circuit Including a Field-Effect Transistor and a Bipolar Transistor
Application:
16/181,601 →
Publication:
US 2019/0074374
Systems and Methods for Voltage Settling
Reinforced Semiconductor Die and Related Methods
Global Shutter Imaging Pixels
Image Sensors with Vertically Stacked Photodiodes and Vertical Transfer Gates
Area and Power Efficient Multi-Voltage Row Driver Circuitry for Image Sensors
Electronic Device Including a Contact Structure Contacting a Layer
Charge Pump with Individualized Switching Control
Patent:
10,587,190 →
Application:
16/183,844 →
Image Sensor Flip Chip Package
Identifying Voltage to Prevent Motor Integrated Circuit Damage
Image Sensors Having High Dynamic Range Imaging Pixels
Methods and Apparatus for Focus Control in an Imaging System
Programmable Battery Protection System and Related Methods
Programmable Battery Protection System and Related Methods
Three-Phase Brushless Motor State Identification
Image Sensors with Testing Capabilities
Transducer Controller and Method Therefor
Methods and Apparatus for Autofocus
Tunable Resonant Inductive Coil Systems for Wireless Power Transfer and Near Field Communications
Switch Control Circuit and Buck Converter Including the Same
Methods of Forming Leadless Semiconductor Packages with Plated Leadframes and Wettable Flanks
Methods and Apparatus for Controlling a Bias Voltage
Image Sensors Having Dark Pixels and Imaging Pixels with Different Sensitivities
Methods and Apparatus for Transform Coefficient Encoding and Decoding
Methods and Apparatus for Successive Intra Block Prediction
Flexible Interconnect Sensing Devices and Related Methods
Packaging Structure for Gallium Nitride Devices
Reconfigurable Mimo Radar
Semicoductor Wafer and Method of Backside Probe Testing Through Opening in Film Frame
High Reliability Housing for a Semiconductor Package
Application:
16/204,097 →
Publication:
US 2019/0096938
Low Power Sensor Communication Using Two or Fewer Wires
Semiconductor Package
Method for Forming a Semiconductor Package
Semiconductor Copper Metallization Structure and Related Methods
Methods of Forming Three-Dimensional Microlenses for Imaging Pixels
Application:
16/214,972 →
Publication:
US 2020/0183057
Methods and Apparatus for Controlling in-Rush Current During Dynamic Context Switching
Application:
16/215,075 →
Publication:
US 2020/0185910
Power Transistor Device and Method of Controlling the Same
Methods and Apparatus for a Dual Mode Operational Amplifier
Method of Forming a Heterojunction Semiconductor Device Having Integrated Clamping Device
Power Device Including a Field Stop Layer, and Method for Fabricating the Same
Application:
16/215,920 →
Publication:
US 2019/0123144
Methods and Apparatus for Reporting a Relative State of Charge of a Battery
Image Sensors with Color Filter Variations
Method of Making Single Reflow Power Pin Connections
Semiconductor Leadframes and Packages with Solder Dams and Related Methods
Methods and Systems for Motor Control
Start-Up Circuit to Discharge Emi Filter for Power Saving of Power Supplies
Synchronous Rectifier Gate Voltage Boost Method and System
Patent:
10,516,341 →
Application:
16/223,288 →
Cross-Coupled Charge-Pumps
Image Sensor with Selective Pixel Binning
Methods and Apparatus for a Microphone System
Cascode Semiconductor Device Structure and Method Therefor
Circuit and Method for Controlling a Crystal Oscillator
Method of Forming a Semiconductor Device
Image Sensors Having Capacitively Coupled Pixels
Automatically Programmable Battery Protection System and Related Methods
Automatically Programmable Battery Protection System and Related Methods
Load Detecting Device
Semiconductor Backmetal and Over Pad Metallization Structures and Related Methods
Application:
16/229,186 →
Publication:
US 2019/0148306
Systems and Methods for Audio Playback
Leadless Semiconductor Packages, Leadframes Therefor, and Methods of Making
Methods and Apparatus for a Dynamic Addressing Decimation Filter
Patent:
10,530,340 →
Application:
16/232,530 →
Methods and Apparatus for an Operational Amplifier with a Variable Gain-Bandwidth Product
Clip for Semiconductor Package
Methods and Apparatus for an Amplifier Circuit
Methods and Apparatus Related to Termination Regions of a Semiconductor Device
Offset Voltage Trimming for Operational Amplifiers
Application:
62/744,449 →
DSI3xc Single-Ended Wire Emission and Immunity Enhancements
Application:
62/760,679 →
Defect Reduction of Semiconductor Layers and Semiconductor Devices by Anneal and Related Methods
Application:
62/770,266 →
Dual-Mode Frequency Multiplier
Application:
62/776,040 →
Multi-Input Down Conversion Mixer
Application:
62/779,293 →
Methods and System for Position Stabilization
Application:
62/780,704 →
Park Assist System
Application:
62/782,135 →
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 1, 2018
From: SEDDON, MICHAEL J.; CARNEY, FRANCIS J.; WOOLSEY, ERIC
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047022/0553 →
Assignment of Assignor's Interest
Oct 1, 2018
From: KONDO, HIDEO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047017/0827 →
Assignment of Assignor's Interest
Oct 1, 2018
From: MOENS, PETER; CONSTANT, AURORE; COPPENS, PETER; BANERJEE, ABHISHEK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047018/0414 →
Assignment of Assignor's Interest
Oct 1, 2018
From: SEDDON, MICHAEL J.; CARNEY, FRANCIS J.; WOOLSEY, ERIC
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047022/0142 →
Assignment of Assignor's Interest
Oct 2, 2018
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047033/0387 →
Assignment of Assignor's Interest
Oct 3, 2018
From: EUM, HYUN-CHUL; KIM, YOUNG-JONG
To: FAIRCHILD KOREA SEMICONDUCTOR LTD.
Reel/Frame 047058/0302 →
Assignment of Assignor's Interest
Oct 3, 2018
From: ONISHI, AKINOBU
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047057/0450 →
Assignment of Assignor's Interest
Oct 3, 2018
From: KONDO, HIDEO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047059/0827 →
Assignment of Assignor's Interest
Oct 3, 2018
From: FAIRCHILD KOREA SEMICONDUCTOR LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047189/0610 →
Assignment of Assignor's Interest
Oct 3, 2018
From: ZENG, XIANG; WU, XIAOLI; WANG, HAO; NEYER, THOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047056/0577 →
Assignment of Assignor's Interest
Oct 3, 2018
From: LIU, ZHIWEI; DAGAN, MARC; YAO, KAIWEI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047056/0937 →
Assignment of Assignor's Interest
Oct 10, 2018
From: STERN, JONATHAN MICHAEL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047126/0142 →
Assignment of Assignor's Interest
Oct 10, 2018
From: HIZUME, KOJI; HIRANO, MARIKO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047115/0823 →
Assignment of Assignor's Interest
Oct 11, 2018
From: WU, WENG-JIN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047133/0532 →
Assignment of Assignor's Interest
Oct 11, 2018
From: WU, WENG-JIN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047133/0649 →
Assignment of Assignor's Interest
Oct 15, 2018
From: YAMAGISHI, MIKIO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047157/0977 →
Assignment of Assignor's Interest
Oct 15, 2018
From: PARKS, CHRISTOPHER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047167/0977 →
Assignment of Assignor's Interest
Oct 15, 2018
From: CADUFF, CHRISTIAN VENANZI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047158/0444 →
Assignment of Assignor's Interest
Oct 22, 2018
From: GEURTS, TOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047258/0724 →
Release of Security Interest
Jul 25, 2022
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060609/0395 →
Assignment of Assignor's Interest
Aug 2, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: JAPAN TOBACCO INC.
Reel/Frame 060694/0745 →
Release of Security Interest in Patents Recorded at Reel 048327, Frame 0670
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064079/0001 →