Method of making single reflow power pin connections
One illustrative method embodiment includes: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.
1. A method, comprising:
providing a direct bonded copper (DBC) substrate including a plurality of copper traces;
providing a guide plate having protrusions on a surface of the guide plate;
mounting hollow bush rings onto the protrusions;
mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces;
attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and
after said simultaneous reflow, removing the protrusions from the bush rings.
2. The method of claim 1 , further comprising using a vacuum system to retain the bush rings on the protrusions.
3. The method of claim 2 , further comprising disabling the vacuum system prior to removing the protrusions from the bush rings.
4. The method of claim 1 , further comprising inserting power pins into the bush rings.
5. The method of claim 4 , wherein at least one of the power pins has a dimension that exceeds an internal wall surface-to-internal wall surface dimension of a corresponding bush ring.
6. The method of claim 4 , wherein each head of one or more of the power pins has a width that is greatest in the center of the head and comprises an orifice.
7. The method of claim 4 , further comprising establishing electrical contact between said power pins and a printed circuit board (PCB).
8. The method of claim 1 , wherein at least one of the bush rings has a shape that is selected from the group consisting of:
a cross-section that is substantially square when measured from outer wall surface to outer wall surface and one end that is flat, said end located in a plane that is perpendicular to the longitudinal axis of the bush ring;
a cross-section that is substantially square when measured from outer wall surface to outer wall surface and one end at which the wall has multiple raised portions and multiple depressed portions, said end located in a plane that is perpendicular to the longitudinal axis of the bush ring; and
a cross-section that is substantially square when measured from outer wall surface to outer wall surface and one end at which the wall has multiple raised portions and multiple depressed portions, said raised portions extending away from the longitudinal axis of the bush ring, said end located in a plane that is perpendicular to the longitudinal axis of the bush ring.
9. The method of claim 1 , further comprising depositing a molding onto the DBC, bush rings and dies, a surface of the molding being flush with the end of at least one of said bush rings, said end located in a plane that is perpendicular to the longitudinal axis of the bush ring.
10. The method of claim 9 , further comprising using a metal or plastic clip to fasten the molding to a heat sink.
11. A method, comprising:
providing a direct bonded copper (DBC) substrate including a ceramic layer and copper traces on a surface of the ceramic layer;
providing a guide plate having protrusions on a surface of the guide plate;
mating hollow bush rings with the protrusions, wherein each of said bush rings has an end at which the wall of the bush ring has multiple raised portions and multiple depressed portions, said end located in a plane that is perpendicular to the longitudinal axis of that bush ring;
mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces;
attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and
after said simultaneous reflow, removing the protrusions from the bush rings.
12. The method of claim 11 , further comprising using a vacuum system to retain the bush rings on the protrusions.
13. The method of claim 12 , further comprising disabling the vacuum system prior to removing the protrusions from the bush rings.
14. The method of claim 11 , further comprising inserting power pins into the bush rings.
15. The method of claim 14 , wherein at least one of the power pins has a dimension that exceeds an internal wall surface-to-internal wall surface dimension of a corresponding bush ring.
16. The method of claim 14 , wherein each head of one or more of the power pins has a width that is greatest in the center of the head and comprises an orifice.
17. The method of claim 14 , further comprising establishing electrical contact between said power pins and a printed circuit board (PCB).
18. The method of claim 11 , wherein at least one of the bush rings has said raised portions extending away from the longitudinal axis of the bush ring.
19. The method of claim 11 , further comprising depositing a molding onto the DBC, bush rings and dies, a surface of the molding being flush with the end of at least one of said bush rings, said end located in a plane that is perpendicular to the longitudinal axis of the bush ring.
20. The method of claim 19 , further comprising using a metal or plastic clip to fasten the molding to a heat sink.