Semiconductor package structure and related methods
Implementations of semiconductor packages may include: a substrate having a first side and a second side and a die having an active area on a second side of the die. A first side of the die may be coupled to the second side of the substrate. The semiconductor package may also include a glass lid having a first side and a second side. The glass lid may be coupled over a second side of the die. The semiconductor package may include a first and a second molding compound and one or more cushions positioned between a first side of the glass lid and a portion of the first molding compound. The second molding compound may be coupled to the substrate and the around the die and the glass lid.
1. A semiconductor package comprising:
a substrate comprising a first side and a second side;
a die comprising an active area on a second side of the die, a first side of the die coupled to the second side of the substrate;
a glass lid comprising a first side and a second side, the glass lid coupled over a second side of the die;
a first molding compound and a second molding compound forming an interface around the glass lid; and
one or more cushions positioned between a first side of the glass lid and a portion of the first molding compound;
wherein the first molding compound is coupled to the substrate and around the die and the glass lid.
2. The package of claim 1 , further comprising wire bonds electrically coupling the die to the substrate.
3. The package of claim 1 , wherein the die is an image sensor die.
4. The package of claim 1 , wherein the substrate is one of a stripline or a printed circuit board.
5. The package of claim 1 , further comprising a ball grid array on a first side of the substrate.
6. The package of claim 1 , wherein the one or more cushions are comprised of one of epoxy, silicone, acrylic, resin, polyimide, polymer, or any combination thereof.
7. A semiconductor package comprising:
a substrate comprising a first side and a second side;
a die comprising an active area on a second side of the die, a first side of the die coupled to the second side of the substrate;
a glass lid comprising a first side and a second side opposing the first side, the glass lid coupled over a second side of the die;
a first molding compound coupled to the substrate and around a portion of the die, the first molding compound comprising one or more shelves around the die;
a dam positioned on the one or more shelves and the glass lid coupled to the dam; and
a second molding compound coupled with an edge of the first molding compound, the second molding compound coupled over a portion of the second side of the glass lid.
8. The package of claim 7 , further comprising wire bonds electrically coupling the die to the substrate.
9. The package of claim 7 , wherein the die is an image sensor die.
10. The package of claim 7 , wherein the substrate is one of a stripline or a printed circuit board.
11. The package of claim 7 , further comprising a ball grid array on a first side of the substrate.
12. The package of claim 7 , wherein the dam is selected from a group consisting of epoxy, silicone, acrylic, resin, polyimide, polymer, or any combination thereof.
13. A method of forming a semiconductor package, the method comprising:
coupling a first side of a die to a second side of a substrate;
applying a first molding compound to the second side of the substrate and a portion of the first side of the die, wherein the first molding compound comprises a shelf above a second side of the die;
applying a cushion to the shelf;
coupling a first side of a glass lid to the shelf; and
forming a second molding compound on an interface of the first molding compound, the second molding compound coupled around two or more sides of the glass lid and a portion of a second side of the glass lid that opposes the first side.
14. The method of claim 13 , further comprising curing the cushion to form a dam wherein curing comprises one of environmental curing, thermal curing, or ultraviolet curing.
15. The method of claim 13 , wherein the cushion comprises one of epoxy, silicone, acrylic, resin, polyimide, polymer, or any combination thereof.
16. The method of claim 13 , wherein the die is an image sensor comprising an active area on the second side of the die.
17. The method of claim 13 , wherein the substrate is one of a stripline or a printed circuit board.
18. The method of claim 13 , further comprising plasma cleaning the interface of the first molding compound.
19. The method of claim 13 , further comprising electrically coupling the die to the substrate through wire bonds.
20. The method of claim 13 , further comprising applying a ball grid array to a first side of the substrate.