Flexible interconnect sensing devices and related methods
Implementations of sensing devices may include a plurality of electromagnetic radiation sensing sections coupled to a flexible interconnect and one or more digital sections coupled to the flexible interconnect. The plurality of electromagnetic radiation sensing sections may be self-aligned through the flexible interconnect.
1. A method of forming an electromagnetic radiation (EMR) sensing device comprising:
forming a plurality of EMR sensing die in a first side of substrate;
forming a trench partially through the substrate from the first side of the substrate through removing a portion of the substrate between two EMR sensing die of the plurality of EMR sensing die;
coupling a support layer to the first side of the substrate;
singulating the plurality of EMR sensing die through thinning a second side of the substrate opposite the first side of the substrate;
coupling the second side of the substrate to a flexible interconnect;
removing at least a portion of the support layer to fully singulate the plurality of EMR sensing die; and
bending the flexible interconnect at portions of the flexible interconnect corresponding with a location of the trench.
2. The method of claim 1 , wherein the substrate comprises an EMR sensing layer hybrid bonded to an analog layer, wherein the first side of the substrate comprises a side of the EMR sensing layer and the second side of the substrate comprises a side of the analog layer.
3. The method of claim 2 , further comprising forming a through-silicon-via at least partially through the analog layer and exposing the through-silicon-via when thinning the second side of the substrate.
4. The method of claim 1 , further comprising forming the trench through patterning a photoresist layer over the first side of the substrate and etching into the first side of the substrate.
5. The method of claim 1 , wherein the plurality of EMR sensing die each comprise a non-rectangular perimeter.
6. The method of claim 1 , further comprising coupling a digital section to the flexible interconnect.
7. The method of claim 1 , wherein the EMR sensing device comprises a complimentary metal-oxide semiconductor image sensor.
8. The method of claim 1 , further comprising forming the flexible interconnect into a tube shape.