Clip for semiconductor package
Implementations of a clip may include a die attach portion including at least one protrusion extending from the die attach portion and a lead frame alignment portion including at least one alignment feature. The at least one alignment feature may be configured to couple into at least one hole in a lead frame thereby aligning the clip with the lead frame. The at least one protrusion may be configured to couple into at least one recess in the die.
1. A clip comprising:
a die attach portion comprising at least one protrusion extending from the die attach portion; and
a lead frame alignment portion comprising at least one alignment feature;
wherein the at least one protrusion is configured to couple into at least one recess in the die.
2. The clip of claim 1 , wherein the die attach portion comprises four protrusions extending from the die attach portion.
3. The clip of claim 1 , wherein the lead frame alignment portion comprises two alignment features.
4. The clip of claim 1 , wherein a section of the lead frame alignment portion extends in a first direction substantially perpendicular away from the die attach portion, in a second direction substantially parallel away from the die attach portion, and in a third direction parallel to the first direction.
5. The clip of claim 1 , wherein the at least one alignment feature does not cross a plane formed by the die attach portion.
6. The clip of claim 1 , further comprising a plurality of bond features configured to ensure a minimum bonding compound thickness.
7. A clip comprising:
a die attach portion configured to directly couple within a recess comprised in a die; and
a lead frame alignment portion configured to directly couple to a lead frame;
wherein the lead frame alignment portion is configured to fixedly couple the clip to the lead frame in a desired physical arrangement; and
wherein the die attach portion is configured to fixedly couple the clip to the die in a desired physical arrangement.
8. The clip of claim 7 , wherein the lead frame alignment portion is configured to couple in a hole of the lead frame.
9. The clip of claim 7 , wherein the lead frame alignment portion is configured to prevent movement of the clip during one of reflow or adhesive die attach curing of the die.
10. The clip of claim 7 , wherein the lead frame alignment portion does not cross a plane formed by the die.
11. The clip of claim 7 , wherein a section of the clip extends in a first direction substantially perpendicular away from the die, in a second direction substantially parallel away from the die, and in a third direction parallel to the first direction.
12. The clip of claim 7 , wherein the lead frame alignment portion of the clip extending along a side of a semiconductor package is longer than one of a length and a width of the die attach portion of the clip.
13. A semiconductor package comprising:
a die comprising at least one recess in a first side of the die;
a lead frame coupled to the first side of the die; and
a clip comprising;
a die attach portion comprising at least one protrusion extending from the die attach portion; and
a lead frame alignment portion comprising at least one alignment feature and configured to couple to the lead frame;
wherein the at least one protrusion is configured to couple into the at least one recess in the die.
14. The semiconductor package of claim 13 , wherein the lead frame comprises at least one opening extending completely through the lead frame.
15. The semiconductor package of claim 13 , wherein the die attach portion comprises four protrusions and the die comprises four corresponding recesses.
16. The semiconductor package of claim 13 , wherein the lead frame alignment portion comprises two alignment features and the lead frame comprises two openings corresponding with the two alignment features.
17. The semiconductor package of claim 13 , wherein a cross section of the lead frame alignment portion extends in a first direction substantially perpendicular away from the die, in a second direction substantially parallel away from the die, and in a third direction parallel to the first direction.
18. The semiconductor package of claim 13 , wherein the lead frame alignment portion does not cross a plane formed by the die.
19. The semiconductor package of claim 13 , wherein a length of the lead frame alignment portion extending along a side of the semiconductor package is longer than one of a length and a width of the die attach portion.
20. The semiconductor package of claim 13 , wherein the lead frame alignment portion is configured to prevent movement of the clip during one of reflow or adhesive die attach curing of the die.