Patent Assignment
Reel/Frame 047564/0444
Assignment of Assignor's Interest
Recorded: 2018-11-21
Pages: 10
Assignors
TOSAKA, YUJI
Executed: 2018-08-22
SAITOH, TAKESHI
Executed: 2018-08-24
NAKAMURA, YUKIO
Executed: 2018-08-23
SASAKI, RYOHTA
Executed: 2018-08-22
SHIMIZU, HIROSHI
Executed: 2018-08-07
UCHIMURA, RYOICHI
Executed: 2018-09-11
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Metal-Clad Laminate, Printed Wiring Board and Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 3, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061588/0551 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →