Patent Assignment
Reel/Frame 047579/0725
Assignment of Assignor's Interest
Recorded: 2018-11-26
Pages: 4
Assignors
TSAI, PO-HAO
Executed: 2018-11-07
WONG, TECHI
Executed: 2018-11-07
CHOU, MENG-WEI
Executed: 2018-11-07
LIN, MENG-LIANG
Executed: 2018-11-07
CHUANG, PO-YAO
Executed: 2018-11-07
JENG, SHIN-PUU
Executed: 2018-11-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure with Molding Layer and Method for Forming the Same