Patent Assignment
Reel/Frame 047590/0891
Assignment of Assignor's Interest
Recorded: 2018-11-27
Pages: 3
Assignors
WU, CHIA-YANG
Executed: 2018-10-25
JANGJIAN, SHIU-KO
Executed: 2018-10-25
WANG, TING-CHUN
Executed: 2018-10-25
YU, YUNG-SI
Executed: 2018-10-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure with Barrier Layer and Method for Forming the Same