Patent Assignment
Reel/Frame 047601/0425
Assignment of Assignor's Interest
Recorded: 2018-11-19
Pages: 4
Assignors
CHANDOLU, ANILKUMAR
Executed: 2018-11-12
KING, MATTHEW J.
Executed: 2018-11-13
CHARY, INDRA V.
Executed: 2018-11-09
CLAMPITT, DARWIN A.
Executed: 2018-11-09
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 525, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods of Forming a Semiconductor Device, and Related Semiconductor Devices and Systems
Patent:
10,566,241 →
Application:
16/194,926 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest
Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →