Patent Assignment
Reel/Frame 047605/0833
Assignment of Assignor's Interest
Recorded: 2018-11-28
Pages: 7
Assignors
CHEN, HSIA-WEI
Executed: 2017-10-11
CHU, WEN-TING
Executed: 2017-10-11
LIAO, YU-WEN
Executed: 2017-10-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method for Forming a Homogeneous Bottom Electrode via (Beva) Top Surface for Memory